Item |
Standard |
High-end product |
Layer |
2-12 Layer |
14-18 Layer |
PP Laminate / PP： |
Maximum board thickness |
196.9 mil (5.00mm) |
236.2 mil (6.00mm) |
Minimum board thickness ( 4 layers) |
16 mil (0.4mm) |
15 mil (0.38mm) |
Minimum board thickness ( 2 layers) |
12 mil (0.3mm) |
9.8 mil (0.25mm) |
Minimum core thickness |
4 mil (0.10mm) not include copper |
2 mil (0.05mm) not include copper |
Largest Panel Size |
18" X 24" (457.2 X 609.6 mm) |
24" X 26" (533.4 X 609.6 mm) |
Thinnest PP thickness |
2.0 mil (0.05mm) |
2.3mil (0.051mm) |
Copper： |
Maximum inner layer copper thickness |
2.0 oz |
3.0 oz |
Minimum inner layer copper thickness |
0.5 oz |
0.3 oz |
Maximum outer layer copper thickness |
2.0 oz |
5.0 oz |
Minimum outer layer copper thickness |
0.5 oz |
0.3 oz |
Through hole trace stack up： |
Stack up |
Rigid and Flexible Printed Circuit |
Blind/ Buried via hole |
Smallest drill size |
10 mil (0.25mm) |
8 mil (0.2mm) |
Smallest laser drill size |
4 mil (0.100mm) |
3 mil (0.076mm) |
Aspect ratio |
6/1 |
12/1 |
Trace： |
Line width/ spacing in outer layer |
4/4 mil |
3/3 mil |
Line width/ spacing in inner layer |
4/4 mil |
3/3 mil |
Pitch limited SMT spacing |
12 mil (0.3 mm) |
8 mil (0.2 mm) |
Pitch limited BGA spacing |
6 mil (0.15 mm) |
4 mil (0.1 mm) |
Solder mask and surface treatment： |
Limited solder mask print width |
4 mil (0.102 mm) |
3 mil (0.075 mm) |
Solder mask print registration tolerance control |
± 3 mil |
± 2 mil |
Surface treatment |
Entek, ENIG, HASL |
Immersion Silver, Tin |
Others： |
Impedance control |
45 Ω ± 10% |
40 Ω ± 7% |
Layer registration tolerance control |
± 8 mil (0.2 mm) |
± 6 mil (0.15 mm) |
Board thickness tolerance control |
± 10% |
± 5% |
使用機台 |
YAMAHA YG100B |
Stencil Size Range (鋼板尺寸) |
736 mm × 736 mm |
Min. IC Pitch (IC最小腳距) |
0.30 mm |
Max. PCB Size for YAMAHA(PCB最大尺寸) |
600 mm × 360 mm |
Min. PCB Thickness (PCB最小厚度) |
0.35 mm |
Min. Chip Size (Chip 最小尺寸) |
01005(0.1” × 0.05”) |
Max. BGA Size for YAMAHA(BGA尺寸) |
80 mm × 80 mm |
BGA Ball Pitch for YAMAHA (球間距尺寸) |
0.5 mm (Min) |
BGA Ball Diameter for YAMAHA (球徑尺寸) |
0.20 mm (Min) |
QFP Lead Pitch for YAMAHA (腳間距尺寸) |
0.38 mm (Min) |
上件誤差 |
0.05mm |
Frequency of Stencil Cleaning (鋼板擦拭頻率) |
1 time / 5 ~ 10 Pieces |
